Semiconductors for BBU / DU / CU 2024

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Detailed analysis of baseband semiconductors for 4G, 5G, and 6G base stations, including macro and Open RAN small cell infrastructure. THe architectural differences between ASICs, Semi-custom ICs, and FPGAs (various SoCs) are explored to compare technical aspects and to illustrate the business issues related to choosing each option. Virtual RAN, in-line and look-aside acceleration, and IC integration/partitioning trends are investigated toroughly to illustrate the future of the base station market. The forecast extends through 2032 to show the transition to 6G and vRAN. Includes shipment, pricing, revenue, and market share data for BBU, DU, and CU.

April 2024.

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Detailed analysis of baseband semiconductors for 4G, 5G, and 6G base stations, including macro and Open RAN small cell infrastructure. THe architectural differences between ASICs, Semi-custom ICs, and FPGAs (various SoCs) are explored to compare technical aspects and to illustrate the business issues related to choosing each option. Virtual RAN, in-line and look-aside acceleration, and IC integration/partitioning trends are investigated toroughly to illustrate the future of the base station market. The forecast extends through 2032 to show the transition to 6G and vRAN. Includes shipment, pricing, revenue, and market share data for BBU, DU, and CU.

April 2024.

Detailed analysis of baseband semiconductors for 4G, 5G, and 6G base stations, including macro and Open RAN small cell infrastructure. THe architectural differences between ASICs, Semi-custom ICs, and FPGAs (various SoCs) are explored to compare technical aspects and to illustrate the business issues related to choosing each option. Virtual RAN, in-line and look-aside acceleration, and IC integration/partitioning trends are investigated toroughly to illustrate the future of the base station market. The forecast extends through 2032 to show the transition to 6G and vRAN. Includes shipment, pricing, revenue, and market share data for BBU, DU, and CU.

April 2024.

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